功能

• A simple package version of the popular solder remover.
• Since the pump and suction nozzle are directly connected, a quick vacuum arrival time and instant strong suction (vacuum arrival 650mmHg) are realized.
• High-power (100 V/100 W) high-capacity ceramic heaters are used, making them ideal for solder removal work on multilayer substrates (4 to 8 layers).
• The floating structure of the mechanical part further reduces vibration and noise.
• You can also remove SMD parts by operating the hot air switch lever and using the dedicated hot air nozzle.
• There is no clogging of the nozzle even if the original discharge function removes lead-free solder.