功能

• Exfoliation strength equivalent to conventional eutectic solder. Non-cleaning type solder with high performance yam.
• The flux residue is not corrosive at all, and cleaning of the substrate is not necessary.
• The residue has excellent non-hygroscopic and electrical insulation properties.
• It has good activity persistence and excellent wettability.
• Organic amine type special active rosin (non-chlorine type) is used.
• JIS-AA class, MIL-RMA standard compatible.
• For copper and copper alloy precision substrates.